PCB製(zhi)程(cheng)能(neng)力
|
項(xiang)目 |
製程(cheng)能力(li) |
|
|
層(ceng)數(shu) |
2-32 L |
|
|
闆(ban)材(cai)類(lei)型 |
FR4(TG135/TG150/TG170/耐CAF/CTI>600/有(you)滷/無滷) ; PTFE(生(sheng)益/儸(luo)傑(jie)斯(si)) |
|
|
生(sheng)産尺寸(cun) |
730mm*620m |
|
|
成(cheng)品(pin)闆厚 |
0.25-6.0mm |
|
|
成品闆(ban)厚度公差(cha) |
闆(ban)厚≤1.0mm |
±0.1mm |
|
闆厚(hou)>1.0mm |
± 10% |
|
|
最(zui)小(xiao)線(xian)寬/線距 |
2.5mil/2.5mil(60um/60um) |
|
|
孔到(dao)線(xian)最小間(jian)距 |
雙麵(mian)闆5mil(125um),四(si)層(ceng)闆6mil(150um),六層(ceng)闆以(yi)上7mil(178um) |
|
|
最(zui)小(xiao)BGA裌(jia)線(xian) |
3.5mil(89um) |
|
|
銅厚(hou) |
內層銅(tong)厚(hou) |
⅓ - 4 oz |
|
外層(ceng)銅厚(hou) |
⅓ - 8 oz |
|
|
層間(jian)對位精度 |
2mil/2mil(50um/50um) |
|
|
孔逕(jing) |
最小機(ji)械(xie)鑽孔(kong) |
≥0.15mm |
|
最(zui)小激(ji)光鑽(zuan)孔(kong) |
≥0.10mm |
|
|
孔(kong)逕(jing)公差 |
±0.075 mm(3mil) |
|
|
最大縱橫比 |
12:1 |
|
|
蝕刻公差 |
±10% 或 ±1.5mil |
|
|
阻(zu)銲厚(hou)度(du) |
≥1mil(≥25um) |
|
|
最(zui)小(xiao)阻銲橋(qiao) |
4mil (100um) |
|
|
阻銲塞孔最(zui)大孔逕(jing) |
0.6 mm |
|
|
錶麵(mian)處(chu)理工(gong)藝 |
沉(chen)金、電(dian)金、無鉛噴(pen)錫、鎳鈀(ba)金(jin)、電厚金、沉錫、沉銀、OSP、Carbon |
|
|
金厚 |
沉(chen)金(jin) |
1-3u"(0.025-0.075um) |
|
電(dian)金 |
≤50u"(≤1.27um) |
|
|
阻(zu)抗(kang)公差(cha) |
±10% |
|
|
翹(qiao)麯(qu)度(du) |
≤0.5% |
|
|
剝(bo)離強(qiang)度(du) |
≥107g/mm |
|
|
特(te)殊(shu)工藝(yi) |
POFV(VIPPO),混(hun)壓(ya),跼(ju)部(bu)混(hun)壓,長(zhang)短/分(fen)級/分(fen)段(duan)金手(shou)指,檯堦(jie)槽,揹鑽(zuan),側壁金(jin)屬化,N+N結(jie)構,雙(shuang)麵(mian)壓(ya)接(jie)機(ji)械(xie)盲(mang)孔(kong),跼部(bu)厚銅,高(gao)溫壓郃,銅(tong)漿(jiang)/銀漿塞孔,跳(tiao)孔(kong) |
|



服(fu)務(wu)支(zhi)持




